OCZ EL DDR PC-3200 Gold GX XTC 2GB Dual Channel Kit

Introduction

Developed with gamers in mind, the new OCZ PC-3200 1024MB Gold GX XTC Edition, provides excellent performance and stability for todays applications and gaming titles. The OCZ PC-3200 1024MB Gold GX Edition is part of the OCZ's high performance Gold Series and today we are going to take the 2048MB Dual Channel Kit for test drive. The product promises unprecendented performance and value for its mid-high end offering and is said to offer blazing speeds under the most demanding game titles at a reduced cost over the Platinum Series.

For those budget minded individuals that require a bigger bang for a smaller investment will benefit from the raw performance of OCZ Technology's Gold GX XTC Series. The GX XTC Series, with enhanced latencies, enhanced bandwidth and stability, providing a premium gaming experience for titles that require aggressive memory timings and latencies for maximum performance and glitch free operations. OCZ has found the answer with the OCZ PC-3200 1024MB Gold GX XTC Edition Dual Channel Kit. Let's dig deeper...

OCZ XTC Heatspreaders

The OCZ PC-3200 1024MB Gold GX XTC Edition gives the gamer amazing heat dissapation, enhanced stability and performance, due in part to the new Xtreme Thermal Convection (XTC) process. This new design set's a new standard in heat spreader technology by optimizing the convection process to facilitate optimum thermal transference, while increasing convection by allowing the heat source to rapidly release thermal transference through the heat spreader integrated honeycomb system.

This process removes heat away from the Integrated Circuits (IC's) in an open air style convection process. The results provide better over clocking and performance by reducing heat pockets and hot spots found on traditional designs. The honeycomb spreader responds well to active cooling or near by CPU fans that push air around the XTC spreader.

Another cool aspect to factor in, is the OCZ EVP or Extended Voltage Protection, allowing the customer to run a VDIMM of 2.9V ± 5% without invalidating their OCZ Lifetime Warranty. What this means to you, is the fact you can pump your ram voltage up to 2.9 volts to over-clock without voiding the factory life time warranty.

The Gold XTC Series incorporates the latest in OCZ research and development by utilizing ULN Technology or Ultra-Low Noise Technology. This allows lower noise to signal ratio increasing the data intgrity by creating a more stable PCB. This technology effectively reduces noise and interference, increasing speed and stability.

End user's are used to seeing DDR400 with CL's of 2-2-2-5, to keep this into perspective, we have to remind you that these sticks of ram are large density, high capacity 1024MB per channel, giving us a total of 2048MB of extended ram in a dual channel environment.

A CL of 2-3-3-8 is one of the most aggressive latencies in the DDR400 2048MB dual channel family. We should see some excellent performance at the specifications we are seeing. Today's game titles need capacity and speed, the OCZ PC-3200 1024MB Gold GX XTC Edition promises to deliver just that.

Specifications

• 400MHz DDR
• CL 2-3-3-8 (CAS-TRCD-TRP-TRAS)
• Unbuffered
• 184 Pin DIMM
• 2.8 Volts
• Lifetime Warranty
• 2GB (2x1024) D/C Kit PN - OCZ4002048ELGEGXT-K

XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.

OCZ EVP® (Extended Voltage Protection) is a feature that allows performance enthusiasts to use a VDIMM of 2.9V ± 5% without invalidating their OCZ Lifetime Warranty.

ULN (Ultra Low Noise) technology uses various printed circuit board (PCB) techniques to reduce the amount of electrical noise that is present in all high-speed ICs. This results in faster and more stable memory.